2022.12.21
Points of this article
・In recent years, SiC MOSFETs have been used increasingly frequently in power supply and power line switching applications, but they are so fast that the effects of the self inductance of the package of the MOSFET and that of peripheral circuits wiring cannot be ignored.
・For this reason, unexpected surges sometimes occur in the gate-source voltage in particular, and these must be addressed.
Power semiconductors such as MOSFETs and IGBTs are used as switching elements in various power supply applications and power lines. Among these devices, SiC MOSFETs have been used more and more frequently in recent years, and operate so rapidly that the effects of the inductance of the package of the MOSFET itself and the wire self inductance of peripheral circuits on changes in voltage and current during switching cannot be ignored. In particular, when the voltage or current of the device itself changes, unexpected surges may occur in the gate-source voltage, necessitating special measures. Here we examine and consider such measures. Surges occurring in gate-source voltages are explained in detail in “SiC MOSFETs: Behavior of Gate-Source Voltage in a Bridge Configuration” in the Applications Edition of the Tech Web Basic Knowledge section on SiC Power Devices, which the reader is invited to consult.
The circuit diagram on the right is the simplest synchronous boost circuit that uses MOSFETs in a bridge configuration. In this circuit, the high side (hereafter HS) SiC MOSFET is switched in synchronization with switching of the low side (LS) SiC MOSFET. When the LS turns on, the HS turns off, and when the LS turns off the HS turns on, in alternating on/off operation.
Through this switching, surges occur not only on the switching LS, but also on the synchronized HS according to changes in the voltage and current on the switching LS.
The waveform diagram below shows the waveforms of the drain-source voltage (VDS) and the drain current (ID) upon LS turn-on and turn-off in the circuit, as well as the behavior of the gate-source voltage (VGS). The horizontal axis represents time, and time intervals Tk (k = 1-8) are defined as follows.
T1: Interval during which LS is on and the SiC MOSFET currents are changing
T2: Interval during which LS is on and the SiC MOSFET voltages are changing
T3: Interval during which LS is on
T4: Interval during which LS is off and the SiC MOSFET voltages are changing
T5: Interval during which LS is off and the SiC MOSFET currents are changing
T4 to T6: Dead time interval until HS turns on
T7: Interval during which HS is on (synchronous rectification interval)
T8: Dead time interval from turn-off of HS to turn-on of LS
Phenomena (I) to (VI) indicated by arrows occur in the gate-source voltage VGS. The broken lines represent the original waveforms without surges. These phenomena occur for the following reasons.
Phenomena (I), (VI) → Change in drain current (dID/dt)
Phenomena (II), (IV) → Change in drain-source voltage (dVDS/dt)
Phenomena (III), (V) → End of change in drain-source voltage
Among these phenomena, the gate-source voltage surges that we will examine here are the phenomenon (II) occurring on the HS upon LS turn-on, and the phenomenon (IV) occurring on the HS upon LS turn-off, which particularly affect device operation.
ROHM’s seminar materials provided at the seminar venue. Basic properties of silicon carbide(SiC) which has the potential for minimizing the size of power products, reducing power consumption, and enhancing efficiency, how to use SiC diodes and SiC MOSFETs, and application examples utilizing the merits are described.
ROHM’s seminar materials provided at the seminar venue. Basic properties of silicon carbide(SiC) which has the potential for minimizing the size of power products, reducing power consumption, and enhancing efficiency, how to use SiC diodes and SiC MOSFETs, and application examples utilizing the merits are described.