200 V Schottky Barrier Diodes：RBxx8BM200 / RBxx8NS200 : Replaces FRD in 200 V Applications, for Improved Efficiency, Space Savings

The RBxx8BM200 and RBxx8NS200 are new Schottky Barrier Diode (SBD) products that have an ultra-low I_R (reverse current) and have achieved a 200 V high voltage. They expand the lineup of the 150 V RBxx8 series, adding eight new models. Their development was driven by the need for reduced losses (higher efficiencies) and smaller sizes in 200 V applications, and for improved reliability with respect to imperviousness to thermal runaway and the like.

Major applications include automotive systems such as powertrains (xEV and the like), industrial equipment inverters, and various power supplies.

In power supplies and automotive equipment that are used in high-temperature environments, there are mounting demands to replace rectifying diodes and FRDs with SBDs, which have lower V_F and loss values and therefore generate less heat. However, as the operating environment temperature of an SBD rises, there is a tendency for the I_R to increase, leading to the possibility of thermal runaway.

The RBxx8 series are SBDs which have achieved ultra-low I_R and satisfactory temperature characteristics by adopting a barrier metal optimized for high-temperature operation. The new RBxx8BM200/RBxx8NS200 products can be used at 200 V, and so can replace FRDs even in 200 V applications, and can be used without worries about thermal runaway while affording improved efficiency.

Through the realization of RBxx8BM200/RBxx8NS200 models capable of handling 200 V, it is possible to replace FRDs with SBDs in applications where 200 V capabilities are required. The RBxx8BM200/RBxx8NS200 can lower V_F by about 11% compared with FRDs, and so can reduce losses and improve application efficiency.

Heat generation can be suppressed through a lower V_F of the diode section, and so designs can utilize one size smaller packages than those for previous products.

Work is in progress to develop intermediate-power versions of the current TO-252 (DPAK) and TO-263S (D2PAK) packages. In future, it will be possible to replace 5.9 × 6.9 mm packages used for FRDs with smaller 2.5 × 4.7 mm packages, reducing the footprint by 71%.