Sensors｜Basic
MEMS-Related Terminology
MEMS-Related Terminology
A brief overview of MEMS-related terminology.
| Terminology | Definition |
|---|---|
| MEMS | Abbreviation for Micro Electro Mechanical Systems. A general term for device systems featuring minute 3-dimensional structures for handling various input/output signals. |
| Isotropic Etching | Etching that progresses in depth and lateral direction due to radicals |
| Anisotropic Etching | Etching that progresses in depth direction due to ions |
| Bosch Process | The primary technology used for silicon deep etching. Combines both isotropic and anisotropic etching techniques. |
| Scallops | The uneven shape of the sidewalls formed by the Bosch process |
| SOI Wafers | Short for Silicon On Insulator. A silicon wafer in which a single silicon crystal layer is formed on an oxide film. |
| TAIKO Grinding | A wafer grinding process that grinds only the inner portion, leaving the outer edge of the wafer intact. TAIKO is a trademark of Disco Corp. |
| Support Wafer | Wafers that provide support during the processing and handling of thin wafers |
| Wafer Attaching | Attaching support substrates for the purpose of processing and handling thin wafers |
| Wafer Bonding | Bonding wafers together for the process of sealing |
| ALD (Atomic Layer Deposition) | A thin-film deposition method that sequentially stacks layers at the atomic level. |
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