SiC Power Device|Application
Behavior of Gate-Source Voltages when in a Bridge Configuration: Behavior at Turn-on
2024.04.03
Points of this article
・There are differences in the behavior of the gate-source voltages of SiC MOSFETs in TO-247-4L and T-263-7L packages, which have driver source terminals, and devices in TO-247N packages, which do not have driver source terminals.
・In order to precisely implement gate-source voltage surge countermeasures, the behaviors of both kinds of devices must be understood.
The most widespread application of power switching devices is in bridge configurations similar to those of double pulse test circuits such as that presented in the previous article. The behavior of gate-source voltages in bridge configurations, relating to mutual interaction, has been explained in a Tech Web Basic Knowledge article on SiC power devices, “SiC MOSFETs: Behavior of Gate-Source Voltage in a Bridge Configuration“, and in an application note that is the basis for the former article, “Gate-Source Voltage Behavior in a Bridge Configuration“.
However, there are differences in the behavior of SiC MOSFETs in the TO-247-4L and TO-263-7L packages having driver source terminals and SiC MOSFETs in the TO-247N package without a driver source terminal. In order to precisely implement measures to deal with gate-source voltage surges, these differences in behavior must be understood.
In this and the next article, the behavior of the gate-source voltages in a SiC MOSFET bridge configuration using devices in the TO-247-4L package with a driver source terminal is explained, considering separately the behavior upon LS (low-side) MOSFET turn-on and the behavior at LS MOSFET turn-off.
Behavior of Gate-Source Voltages when in a Bridge Configuration: Behavior at Turn-on
The behavior of LS (low-side) MOSFETs in a bridge configuration at turn-on is here explained, focusing mainly on the differences with devices in TO-247N packages not having a driver source terminal.
The following waveform diagrams show switching waveforms at turn-on; the diagrams on the left are for devices in TO-247N packages which do not have driver source terminals, while the diagrams on the right are for devices in TO-247-4L packages having driver source terminals. Both horizontal axes denote time, and the time intervals Tk (k=7, 8, and 1-3) are defined as indicated. The circuit diagram on the lower right indicates the currents in the gate terminals of TO-247-4L package devices in a bridge circuit. Events occurring in the different time intervals are labeled (I) to (III) in both the waveform diagrams and the circuit diagram. The event (III) occurs immediately after the interval T2 has ended.

Devices in TO-247N packages not having driver source terminals

Devices in TO-247-4L packages having driver source terminals
Switching waveforms at turn-on of LS SiC MOSFETs in a bridge configuration
< Definitions of time intervals Tk >
- T7: Interval during which HS is on (synchronous rectification interval)
- T8: Dead time interval in which HS is off, until LS turns on
- T1: Interval in which LS is on and the MOSFET currents are changing (at the same time, event (I) occurs)
- T2:Interval in which LS is on and the MOSFET voltages are changing (at the same time, event (II) occurs)
- T3:Interval in which LS is on

TO-247-4L: Currents in gate terminals at LS turn-on
When comparing the waveform diagrams, the event (I) seen in the TO-247-4L devices differs markedly from that in TO-247N devices: a positive surge in VGS for non-switching side (HS) devices is observed (for the TO-247N devices, the surge is negative). This occurs because a current ICGD (HS, green line) during event (I) flows, indicated in the circuit diagram showing the gate terminal currents. This current flows through the gate-drain capacitor CGD.
The reason for this current is that prior to switching operation, a commutation current ID_HS is flowing in the body diodes of the HS SiC MOSFETs from the source toward the drain, but when switching operation then begins, the switching-side (LS) current ID_LS first increases, and so ID_HS decreases. On the other hand, in general the forward voltage VF_HS of the body diodes of SiC MOSFETs (the dashed circle part in the TO-247-4L waveform diagrams) has a large current dependence, and so when switching is faster dID_HS/dt rises and dVF_HS/dt also increases. Because dVF_HS ultimately is also the dVDS_HS of the commutation-side SiC MOSFETs, the current ICGD flows from the drain terminal through CGD to the gate terminal, inducing a rise in the gate-source voltage. In devices in conventional TO-247N packages, the change in ID_LS is slow, and it may be that there is almost no flowing of ICGD in event (I).
For details of turn-on operation of devices using the TO-247N package, please see either the SiC power device article in Tech Web Basic Knowledge mentioned at the outset, “SiC MOSFETs: Behavior of Gate-Source Voltage in a Bridge Configuration“, or the Application Note item on “Behavior of Gate Signals at Turn-on“.
The VDS waveforms shown on the right are a comparison of TO-247N and TO-247-4L devices. On examining the VDS_HS waveform for the commutation-side SiC MOSFETs, we see that immediately after switching operation has begun, VDS_HS for the TO-247-4L device rises sharply. This is, as explained in the previous article, the result of faster operation due to the provision of a driver source terminal.
Moreover, operation is also faster in event (II), so that the current flowing from HS to LS in the above circuit diagram and charging the HS CDS is also larger, and therefore there are cases in which measures are needed to deal with drain-source surges not only on the switching side, but also on the non-switching side.

Comparison of VDS waveforms at turn-on of TO-247N and TO-247-4L devices
Shown next are the VGS waveforms for TO-247-4L devices, comparing the behavior when surge countermeasures are present and not present. When there are no surge countermeasures present (“non-protected”), surges occur, as explained above. When surge countermeasures are implemented (“protected”), we see that VGS surges are suppressed.
In order to suppress such surges, it is essential that the behavior of the gate-source voltage explained above be understood, and that a surge suppression circuit be connected in proximity to the relevant SiC MOSFETs.
For further details, please refer to either the Application Note on “Gate-Source Voltage Surge Suppression Methods“, or to “SiC MOSFETs: Methods for Suppressing Gate-Source Voltage Surges” in the section of Tech Web Basic Knowledge on SiC power devices.

VGS waveforms at turn-on of TO-247-4L devices
(With and without countermeasures)
The next article will explain behavior at turn-off.
【Download Documents】 Basics of SiC Power Devices
This handbook explains the physical properties and advantages of SiC, the differences in characteristics and usage of SiC Schottky barrier diodes and SiC MOSFETs with a comparison to Si devices, and includes a description of full SiC modules with various advantages.
SiC Power Device
Basic
- What are SiC Schottky barrier diodes? ? Introduction
- What are SiC-MOSFETs? – SiC-MOSFET Features
- What are Full-SiC Power Modules?
- Summary
- Introduction
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Application
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Introduction
- SiC MOSFET Bridge Configuration
- SiC MOSFET Gate Driving Circuit and Turn-On/Turn-Off Operation
- Currents and Voltages Occurring Due to Switching in Bridge Circuits
- Behavior of the Gate-Source Voltage During Low-side Switch Turn-on
- Behavior of the Gate-Source Voltage During Low-side Switch Turn-off
- Summary
- SiC MOSFETs: Method for Determining Losses from Switching Waveforms
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SiC MOSFETs: Snubber Circuit Designs ーIntroductionー
- Non-Discharge RCD Snubber Circuit Design
- Surges Occurring between Drain and Source
- Types and Selection of Snubber Circuits
- C Snubber Circuit Design
- RC Snubber Circuit Design
- Discharge RCD Snubber Circuit Design
- Non-Discharge RCD Snubber Circuit Design
- Differences in Surge Occurrence Depending on Package
- SiC MOSFETs: Snubber Circuit Designs ーSummaryー
- Points to Note When Measuring SiC MOSFET Gate-Source Voltages: General Measurement Methods
-
Conventional MOSFET Driving Method
- Packages Provided with Driver Source Terminals
- Differences Made by and Benefits of a Driver Source Pin
- Benefits of a Driver Source Terminal: Comparisons Using Double Pulse Tests
- Behavior of Gate-Source Voltages when in a Bridge Configuration: Behavior at Turn-on
- Behavior of Gate-Source Voltages when in a Bridge Configuration: Behavior at Turn-off
- Points to be Noted Relating to Board Wiring Layout Key Points of This Article
- Verification of Loss Reduction Using Latest-Generation SiC MOSFETs
- About Surges in Gate-Source Voltages
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