Engineer Column
Harmonizing Circuit Design and EMC DesignPart 4 Product Specifications (1) Product Specifications of Semiconductor Integrated Circuits
2021.08.18
Good day! Inagaki of ROHM here.
In Part 4, we describe semiconductor integrated circuit product specifications. The phrase “semiconductor integrated circuit product specifications” may sound rather pretentious, but it is perhaps more often known as an “IC datasheet”. It is absolutely necessary when using an IC, and of course design is not possible without the spec information. However, it cannot be said that an engineer always necessarily understands absolutely everything up to and including the finest details of the datasheet. In this column, I’d like to talk about some of the essentials of the specifications, parts of the datasheet that need to be emphasized.
ROHM product specifications are generally written in the following order: product name, part number, general description, features, applications, key specifications, package, typical application circuits, pin configuration, pin description, block diagram, description of blocks, absolute maximum ratings, thermal resistance, recommended operating conditions, description of functions, electrical characteristics, typical performance curves, application examples, I/O equivalence circuits, operational notes, ordering information, marking diagram, physical dimension and packing information, revision history, and notice.
Among these, the absolute maximum ratings, recommended operating conditions, and electrical characteristics are especially important.
The first of these, absolute maximum ratings, are of course the maximum values of electrical rated values; if a voltage, current, or the like exceeding these values even for an instant is applied, device operation is not guaranteed. They are the maximum values up until which the semiconductor IC device is guaranteed not to be damaged or to fail. Apart from voltages and currents, these absolute maximum ratings also include values for the maximum junction temperature and storage temperature.
The second of these, the recommended operating conditions, describes conditions such as the power supply voltage and input/output needed to most effectively exploit the performance of the semiconductor integrated circuit. The semiconductor IC is designed assuming that it will be operated under these conditions, and so as a rule, the device should be operated under the conditions described.
The third category, electrical characteristics, are the most important, as they indicate the guaranteed characteristics of the semiconductor integrated circuit. All the guaranteed values appearing on the datasheet are warranted as correct. Inspections are performed before shipping to ensure that guaranteed values, and mainly the typical values of the different characteristics, are satisfied. During product design, the electrical design must be performed so as to ensure that the device operates normally with electrical characteristics within the guaranteed values.
Well then, how is electromagnetic compatibility (EMC) related? In many cases, information related to EMC appears on the top page of the product specifications. This is, to be specific, such information as “AEC-Q100 compatible”, “highly EMI tolerant”, “EMARMOUR™ series”, “CISPR25 Class 5”, and the like.
AEC-Q100 is one type of automotive noise emission standard, established for customers by the Automotive Electronics Council (AEC); categories include the following.
- AEC-Q100: Semiconductor integrated circuits (LSIs, ICs, etc.)
- AEC-Q101: Discrete semiconductor components (transistors, diodes, etc.)
- AEC-Q200: Discrete passive components (resistors, capacitors, inductors, etc.)
In AEC-Q100, ambient temperatures during operation are defined as grades 0 to 3. The low-temperature side is -40°C, and on the high-temperature side there are, in grade order, +150°C, +125°C, +105°C, and +85°C. In REV-G Appendix 5 of the same standard, SAE J1752/3 is cited, and radiated emission (RE) by a TEM cell or a wideband TEM cell is defined.
High EMI tolerance, and inclusion in the EMARMOUR™ series, mean that the device does not easily malfunction due to external electromagnetic compatibility (EMC) noise (that is, the semiconductor integrated circuit tends not to malfunction even in an environment with a large amount of electromagnetic noise).
Conformance to Class 5 of the CISPR25 standard means that, in the automotive noise emission standard (international IEC standard), conducted emission and radiated emission are below the limiting values (only small amounts of electromagnetic noise are generated by semiconductor integrated circuits). Class 5 limiting values are the strictest.
As a slight digression, in the international IEC standards and international ISO standards, methods of measurement relating to electromagnetic compatibility (EMC) are standardized. You should be aware though that numerical values appearing in the documents are not standard values, but are limiting values (reference values). In actuality, each of the automotive OEM manufacturers in Europe has its own separate standards, and where measurement methods are concerned, they cite the IEC or ISO standards, but they stipulate their own unique standard values where component delivery is concerned.
Thank you for your kind attention.
【Download Documents】 Switching Power Supply Basic of EMC and Noise Countermeasures
This is a handbook on the basics of EMC (electromagnetic compatibility) and noise countermeasures for switching power supplies. Based on the understanding of the basics of noise, it explains the noise countermeasures using capacitors and inductors in switching power supplies.
Engineer Column
-
Motor Current and Regeneration Current When Using a Single MOSFET in PWM Driving
-
Five Engineers Talk About New Medium-Power Device Products: Part 1 Development of Bipolar Transistors for Gate Driving in Inverter Circuits for xEVs
- Part 2 Fifth-Generation -40 V/-60 V P-channel Power MOSFETs with Greatly Reduced On-Resistance
- Part 3 Super junction MOSFETs Achieve Low On-Resistance, Fast Switching with High 650 V Voltage Rating
- Part 4 Power Diodes Achieve Improved Heat Dissipation Performance, Compactness through Adoption of PMDE Package
- Part 5 The DFN2020WF Package, Developed for External MOSFETs for Automotive Primary Power Supply ICs
-
Evolution and Kinds of Motors
- Features and Selective Use of Sensored and Sensorless Driving of Brushless Motors
- The Role of Brushless Motor Position Sensors and Notes on Their Placement
- Absolute Maximum Ratings of Motor Drivers
- Output Current of Motor Drivers in Actual Use
- Method of Calculating the Power Consumption of a Brushed Motor Driver: Part 1
- Method of Calculating the Power Consumption of a Brushed Motor Driver: Part 2
- Methods for Easily Driving Brushed DC Motors
- Motor Constant-Current Operation through PWM Driving
- Methods and Differences in Current Regeneration for PWM Driving of Brushed Motors
- Conditions for the Maximum Flow of Current in a Motor
- Power Consumption when Current is Regenerated in a Parasitic Diode of a Motor Driver Output Transistor
- Relations between Load Torque, Rotation Rate, and Motor Current of Brushed DC Motors
- PWM Driving of Motors: Relationship between PWM Period and Electrical Time Constant of the Motor
-
Highly Efficient Motor Driving is the Key to the EV Revolution
-
Harmonizing Circuit Design and EMC Design: Introduction
- Part 2 Summary of Semiconductors (2) Semiconductor Integrated Circuits (LSIs, ICs)
- Part 3 Summary of Semiconductors (3) Semiconductor Integrated Circuit (LSI, IC) Modules
- Part 4 Product Specifications (1) Product Specifications of Semiconductor Integrated Circuits
- Part 5 Product Specifications (2) ?How to Read Product Specifications
- Part 6 Product Specifications (3) Examples of General EMC Evaluation Indexes
- Part 7 Evaluation Circuits and Boards (1) Using Evaluation Boards
- Part 8 Evaluation Circuits and Boards (2) Handling of Ground Wires (GND)
- Part 9 Evaluation Circuits and Boards (3) Electromagnetic Interference (EMI) and Electromagnetic Susceptibility (EMS)
- Part 10 Websites (1) The Latest Information, Introduction of Major Products, Product Specs
- Part 11 Websites (2) Application Notes and Design Models
- Part 12 Websites (3) Design Support Tools
- Part 13 EMC Overview (1) What is Electromagnetic Compatibility?
- Part 14 EMC Overview (2) What is Electromagnetic Compatibility?
- Part 15 EMC Overview (3) What is Electromagnetic Compatibility?
- Part 16 EMC Calculation Methods and EMC Simulations (1): Overview of Calculation Methods
- Part 17 EMC Calculation Methods and EMC Simulations (2): Trial Calculation of Conducted Emissions (CE)
- Part 18 EMC Calculation Methods and EMC Simulations (3): Trial Calculation of Radiated Emissions (RE)
- Part 19 EMC Calculation Methods and EMC Simulations (4): Trial Calculation of Conducted Immunity (CI)
- Part 20 EMC Calculation Methods and EMC Simulations (5): Trial Calculation of Conducted Immunity (CI)
- Part 21 EMC Calculation Methods and EMC Simulations (6): Trial Calculation of Radiated Immunity (RI)
- Part 22 EMC Calculation Methods and EMC Simulations (7): Graphical User Interfaces (GUIs)
- Part 23 EMC Calculation Methods and EMC Simulations (8): Three-Dimensional (3D) Plots
- Part 24 EMC Calculation Methods and EMC Simulations (9): GNU Tools Used in Calculation Methods
- Part 1 Summary of Semiconductors (1) Transistors and Diodes