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Surface Temperature Measurements: Methods for Fastening Thermocouples
2023.06.07
Points of this article
・Methods for fastening the tip (junction) of a thermocouple to the package of an IC or other device include ① using polyimide (PI) tape or the like, and ② using an epoxy adhesive.
・The JEDEC standards recommend methods using an epoxy adhesive.
・Apart from the method of attaching the thermocouple tip, the arrangement of the wiring also affects the measurement results, and so the wiring itself is run along the surface of a heat source.
When measuring a surface temperature, the method used to fasten the thermocouple and the arrangement of the wires affect the measurement results. It is important to minimize the effect of the thermocouple fastening method.
Methods for Fastening Thermocouples: Attachment Methods
Methods for fastening the tip (junction) of a thermocouple to the package of an IC or other device include ① use of polyimide (PI) tape or something similar, and ② use of an epoxy adhesive. The JEDEC standards recommend a method using an epoxy adhesive.
The features of each are as follows.
| Fastening method | Advantages | Disadvantages |
|---|---|---|
| Polyimide (PI) tape |
|
|
| Epoxy adhesive |
|
|
Methods for Fastening Thermocouples: Arrangement of Wiring
Apart from the method used to attach the thermocouple tip (junction), the arrangement of the wires also affects the measurement results. The wires must be kept close to the package until the PCB is reached. By doing so, the drop in temperature at the thermocouple junction due to heat dissipation from the wire is alleviated. This is also described as a wiring technique in the JEDEC standards. In other words, the key to accurate surface temperature measurements lies in minimizing heat dissipation caused by the thermocouple.

【Download Documents】 Thermal Design of Semiconductor Components in Electronics
Thermal design has become a new issue in the design of electronic equipment in recent years, as thermal countermeasures have been the focus of attention. Although heat has been an important consideration for some time, the requirements for electronic equipment have changed in recent years, making it necessary to review conventional thermal countermeasures. This handbook describes thermal design based on the assumption that ICs and transistors are basically used in electronic equipment.
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