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About Thermal Design
2020.10.07
Points of this article
・Thermal design is, in a nutshell, designing semiconductor components such that temperatures remain within the maximum rating Tjmax.
・If thermal design is not performed thoroughly in the design stage, problems may be discovered in the prototyping stage or before mass production.
・The closer a countermeasure is to mass production, the greater the amounts of time and money needed for its implementation, and delays in product shipment may result in lost opportunities.
・In the worst case, problems occur in the marketplace, culminating in recalls and loss of trust. Thermal design is vitally important.
Goals in the design of electronic equipment include miniaturization, efficiency improvements, EMC (electromagnetic compatibility), and the like, but in recent years there has been increasing attention paid to thermal issues, and thermal design has emerged as a new problem area. Heat is related to the performance, reliability, and safety of components and equipment, and so has always been one important issue for study. But the demands made of electronic equipment have changed lately, and it has become necessary to take a new look at established practices. Hence Tech Web here considers thermal design.
In this discussion of “Thermal Design of Semiconductor Components in Electronic Equipment”, we address thermal design that basically assumes semiconductor components such as ICs and transistors that are used in electronic equipment.
About Thermal Design
In semiconductor components, an absolute maximum temperature rating Tjmax of the junction temperature, which is the temperature of a chip in its package, is stipulated. In the design stage, heat generation and ambient temperatures must be studied so as to ensure that the component does not exceed Tjmax. Hence thermal calculations are performed for all semiconductor components that are to be used to determine whether or not Tjmax will be exceeded; if it is found that temperatures will rise above Tjmax, measures must be taken to reduce losses or to reconsider heat dissipation, so that the temperature stays within the maximum rating Tjmax. This is thermal design in a nutshell.
Of course, in addition to semiconductor components, various other devices such as capacitors, resistors, motors, and the like are used in electronic equipment, and each of these has absolute maximum ratings relating to temperatures and power losses. Thus in actual practice, the design must ensure that maximum ratings for temperature are not exceeded for all of the components used in any equipment unit.
The Importance of Thorough Thermal Design in the Design Stage
If comprehensive thermal design is not performed in the design stage and measures related to heat not taken, problems originating in heat issues may occur in the product prototyping stage or, in some cases, may be discovered prior to mass production. While not an observation that is limited to heat, it must be remembered that the closer to mass production when a countermeasure is implemented, the greater the time and costs entailed, and if product shipments are delayed, major problems leading to lost business opportunities may occur. In the worst case, problems may occur in the marketplace, possibly culminating in recalls and loss of trust.
Heat-related problems are not pleasant to contemplate, but there is the real possibility of issues ranging from smoke emission to flames and even to fires that could threaten human lives. The essential fact is that thermal design is vitally important. Hence sound thermal design beginning from the initial stages is indispensable.
The Mounting Importance of Thermal Design
In recent years, it has come to be taken for granted that electronic equipment must be more compact and capable of ever higher performance. To this end, integration levels have continued to advance. More specifically, the number of components used has increased, mounting densities on circuit boards are also rising, and housings are made as small as possible. As a consequence, heat generation densities are also rising sharply.
What the reader should first understand is that because of such changes in engineering trends, the demands made on thermal design are greater than ever before. As mentioned above, compactness, high functionality, and also excellent design are demanded not only of equipment, but also of components, and measures to deal with heat have become a major concern. Thermal design is increasingly important insofar as it leads to improved reliability and safety of equipment as well as overall cost reductions.
In articles on thermal design on Tech Web, there are plans to introduce such basic topics as the importance of thermal design, thermal resistance, heat dissipation, examples of estimation of Tj, and thermal simulations.
【Download Documents】 Thermal Design of Semiconductor Components in Electronics
Thermal design has become a new issue in the design of electronic equipment in recent years, as thermal countermeasures have been the focus of attention. Although heat has been an important consideration for some time, the requirements for electronic equipment have changed in recent years, making it necessary to review conventional thermal countermeasures. This handbook describes thermal design based on the assumption that ICs and transistors are basically used in electronic equipment.
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Electrical Circuit Design
- Soldering Techniques and Solder Types
- Seven Tools for Soldering
- Seven Techniques for Printed Circuit Board Reworking
-
Basic Alternating Current (AC)
- AC Circuits: Alternating Current, Waveforms, and Formulas
- Complex Numbers in AC Circuit
- Electrical Reactance
- What is Impedance? AC Circuit Analysis and Design
- Impedance Measurement: How to Choose Methods and Improve Accuracy
- Impedance Matching: Why It Matters for Power Transfer and Signal Reflections
- Resonant Circuits: Resonant Frequency and Q Factor
- RLC Circuit: Series and Parallel, Applied circuits
- What is AC Power? Active Power, Reactive Power, Apparent Power
- Power Factor: Calculation and Efficiency Improvement
- What is PFC?
- Boundary Current Mode (BCM) PFC: Examples of Efficiency Improvement Using Diodes
- Continuous Current Mode (CCM) PFC: Examples of Efficiency Improvement Using Diode
- LED Illumination Circuits:Example of Efficiency Improvement and Noise Reduction Using MOSFETs
- PFC Circuits for Air Conditioners:Example of Efficiency Improvement Using MOSFETs and Diodes
-
Basic Direct Current (DC)
- Ohm’s Law: Voltage, Current, and Resistance
- Electric Current and Voltage in DC Circuits
- Kirchhoff’s Circuit Laws
- What Is Mesh Analysis (Mesh Current Method)?
- What Is Nodal Analysis (Nodal Voltage Analysis)?
- Thevenin’s Theorem: DC Circuit Analysis
- Norton’s Theorem: Equivalent Circuit Analysis
- What Is the Superposition Theorem?
- What Is the Δ–Y Transformation (Y–Δ Transformation)?
- Voltage Divider Circuit
- Current Divider and the Current Divider Rule
Thermal design
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About Thermal Design
- Changes in Engineering Trends and Thermal Design
- A Mutual Understanding of Thermal Design
- Fundamentals of Thermal Resistance and Heat Dissipation: About Thermal Resistance
- Fundamentals of Thermal Resistance and Heat Dissipation: Heat Transmission and Heat Dissipation Paths
- Fundamentals of Thermal Resistance and Heat Dissipation : Thermal Resistance in Conduction
- Fundamentals of Thermal Resistance and Heat Dissipation : Thermal Resistance in Convection
- Fundamentals of Thermal Resistance and Heat Dissipation : Thermal Resistance in Emission
- Thermal Resistance Data: JEDEC Standards, Thermal Resistance Measurement Environments, and Circuit Boards
- Thermal Resistance Data: Actual Data Example
- Thermal Resistance Data: Definitions of Thermal Resistance, Thermal Characterization Parameters
- Thermal Resistance Data: θJA and ΨJT in Estimation of TJ: Part 1
- Thermal Resistance Data: θJA and ΨJT in Estimation of TJ: Part 2
- Surface Temperature Measurements: Methods for Fastening Thermocouples
- Surface Temperature Measurements: Thermocouple Mounting Position
- Surface Temperature Measurements: Treatment of Thermocouple Tips
- Surface Temperature Measurements: Influence of the Thermocouple
- Estimating TJ: Basic Calculation Equations
- Estimating TJ: Calculation Example Using θJA
- Estimating TJ: Calculation Example Using ΨJT
- Estimating TJ: Calculation Example Using Transient Thermal Resistance
- Estimation of Heat Dissipation Area in Surface Mounting and Points to be Noted
- Surface Temperature Measurements: Thermocouple Types
- Summary
- Collection of Important Points Relating to Thermal Design
Switching Noise
- Procedures in Noise Countermeasures
- What is EMC?
-
Dealing with Noise Using Capacitors
- Understanding the Frequency Characteristics of Capacitors, Relative to ESR and ESL
- Measures to Address Noise Using Capacitors
- Effective Use of Decoupling (Bypass) Capacitors Point 1
- Effective Use of Decoupling Capacitors Point 2
- Effective Use of Decoupling Capacitors, Other Matters to be Noted
- Effective Use of Decoupling Capacitors, Summary
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Dealing with Noise Using Inductors
- Frequency-Impedance Characteristics of Inductors and Determination of Inductor’s Resonance Frequency
- Basic Characteristics of Ferrite Beads and Inductors and Noise Countermeasures Using Them
- Dealing with Noise Using Common Mode Filters
- Points to be Noted: Crosstalk and Noise from GND Lines
- Summary of Dealing with Noise Using Inductors
- Other Noise Countermeasures
- Basics of EMC – Summary
Simulation
- Thermal Simulation of PTC Heaters
- Thermal Simulation of Linear Regulators
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Foundations of Electronic Circuit Simulation Introduction
- About SPICE
- SPICE Simulators and SPICE Models
- Types of SPICE simulation: DC Analysis, AC Analysis, Transient Analysis
- Types of SPICE simulation: Monte Carlo
- Convergence Properties and Stability of SPICE Simulations
- Types of SPICE Model
- SPICE Device Models: Diode Example–Part 1
- SPICE Device Models: Diode Example–Part 2
- SPICE Subcircuit Models: MOSFET Example―Part 1
- SPICE Subcircuit Models: MOSFET Example―Part 2
- SPICE Subcircuit Models: Models Using Mathematical Expressions
- About Thermal Models
- About Thermal Dynamic Model
- Summary
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About the ROHM Solution Simulator
- How to Access the ROHM Solution Simulator
- Trying Out the ROHM Solution Simulator (1)
- Trying Out the ROHM Solution Simulator (2)
- Starting a Simulation Circuit in the ROHM Solution Simulator
- ROHM Solution Simulator Toolbar Functions and Basic Operations
- ROHM Solution Simulator: User Interface
- Execution of Simulations
- Method for Displaying Simulation Results
- Simulation Result Display Tool: Wavebox
- Simulation Results Display Tool: Waveform Viewer
- Customization of Simulations
- Exporting Circuit Data to PartQuest™ Explorer
- Purchasing Samples for Evaluation
- Optimization of PFC Circuits
- Optimization of Inverter Circuits
- About Thermal Simulations of DC-DC Converters
- Circuit-Theory-Based Design Simulation