Learn Know-how
Summary
2021.09.29
In the previous articles we have explained how to deal with changes in the various conditions of a PFC circuit, and have used five examples involving study of important parameters and the like to explain adjustment methods and related points. In circuit design and revision tasks, when modifying conditions and evaluating the modifications, hardware must be employed to supplement desktop calculations. However, evaluations using hardware not only incur time and expenses, they may not be feasible under some conditions. For these reasons, circuit simulations are without any doubt a useful tool for design and evaluation activities. Ultimately, evaluations using actual equipment are indispensable, but simulations are advantageous for reducing the time and man-hours leading up to this.
Below are links and key points for each of the sections of this chapter. They should prove useful for detailed analysis.
Key Points:
・The ROHM Solution Simulator is a web-based simulation tool that can be used simply by registering on MyROHM.
・Solution Circuits for simulation of circuit operation are provided in the ROHM Solution Simulator.
・Solution Circuits currently exist in two categories, Power Device Solution Circuits and ICs Solution Circuit
PFC Simulation Circuits Using Solution Circuits
Key Points:
・The ROHM Solution Simulator web page features various information relating to simulations, and different simulations can be run.
・When a product is being considered for use, upon going to the product page, a simulation circuit that can be used immediately can be accessed.
PFC Circuits: Inductance Adjustment
Key Points:
・An example is shown in which, when operating conditions are changed in a PFC CCM circuit, the inductance current ripple ratio is corrected by adjusting the inductance.
・An inductance resulting in an appropriate ripple ratio is calculated, and a simulation is performed to verify the result.
PFC Circuits: Adjustment of Switching Frequency
Key Points:
・An example is given in which, when operating conditions are changed in a PFC Synchronous CCM circuit, the possibility of improving efficiency while maintaining an appropriate inductor current ripple ratio by adjusting the switching frequency is studied.
・A switching frequency resulting in an appropriate ripple ratio is calculated, and a simulation is performed to verify the result.
PFC Circuits: Examination of Appropriate Gate Driving Voltages
Key Points:
・When a SiC MOSFET is used as a switching element, because the change in Ron with changes in the gate driving voltage VGS is considerable, the VGS setting is important.
・When studying the gate driving voltage VGS of a SiC MOSFET, a balance between efficiency and safety should be considered.
PFC Circuits: Changing the Gate Resistance
Key Points:
・When the gate resistance of a switching element is increased, noise is suppressed, but there is a tradeoff with reduced efficiency. Hence it is extremely important that the gate resistance be set so as to achieve a balance.
・Simulations can be used to determine the maximum value of the gate resistance RG when holding switching element losses to below a specific value.
PFC Circuits: Examination of Optimum Dead Time Values
Key Points:
・The dead time settings in a bridge circuit are related to losses and safety, and so must be studied thoroughly.
・The optimum value for the dead time is the shortest time at which a shoot-through current does not occur.
・The switching speed of a switching element varies depending on such factors as the temperature and variation in the manufacturing lot, and so a margin must be added to this shortest time in the design stage.
Learn Know-how
Electrical Circuit Design
- Soldering Techniques and Solder Types
- Seven Tools for Soldering
- Seven Techniques for Printed Circuit Board Reworking
-
Basic Alternating Current (AC)
- AC Circuits: Alternating Current, Waveforms, and Formulas
- Complex Numbers in AC Circuit
- Electrical Reactance
- What is Impedance? AC Circuit Analysis and Design
- Impedance Measurement: How to Choose Methods and Improve Accuracy
- Impedance Matching: Why It Matters for Power Transfer and Signal Reflections
- Resonant Circuits: Resonant Frequency and Q Factor
- RLC Circuit: Series and Parallel, Applied circuits
- What is AC Power? Active Power, Reactive Power, Apparent Power
- Power Factor: Calculation and Efficiency Improvement
- What is PFC?
- Boundary Current Mode (BCM) PFC: Examples of Efficiency Improvement Using Diodes
- Continuous Current Mode (CCM) PFC: Examples of Efficiency Improvement Using Diode
- LED Illumination Circuits:Example of Efficiency Improvement and Noise Reduction Using MOSFETs
- PFC Circuits for Air Conditioners:Example of Efficiency Improvement Using MOSFETs and Diodes
-
Basic Direct Current (DC)
- Ohm’s Law: Voltage, Current, and Resistance
- Electric Current and Voltage in DC Circuits
- Kirchhoff’s Circuit Laws
- What Is Mesh Analysis (Mesh Current Method)?
- What Is Nodal Analysis (Nodal Voltage Analysis)?
- Thevenin’s Theorem: DC Circuit Analysis
- Norton’s Theorem: Equivalent Circuit Analysis
- What Is the Superposition Theorem?
- What Is the Δ–Y Transformation (Y–Δ Transformation)?
- Voltage Divider Circuit
- Current Divider and the Current Divider Rule
Thermal design
-
About Thermal Design
- Changes in Engineering Trends and Thermal Design
- A Mutual Understanding of Thermal Design
- Fundamentals of Thermal Resistance and Heat Dissipation: About Thermal Resistance
- Fundamentals of Thermal Resistance and Heat Dissipation: Heat Transmission and Heat Dissipation Paths
- Fundamentals of Thermal Resistance and Heat Dissipation : Thermal Resistance in Conduction
- Fundamentals of Thermal Resistance and Heat Dissipation : Thermal Resistance in Convection
- Fundamentals of Thermal Resistance and Heat Dissipation : Thermal Resistance in Emission
- Thermal Resistance Data: JEDEC Standards, Thermal Resistance Measurement Environments, and Circuit Boards
- Thermal Resistance Data: Actual Data Example
- Thermal Resistance Data: Definitions of Thermal Resistance, Thermal Characterization Parameters
- Thermal Resistance Data: θJA and ΨJT in Estimation of TJ: Part 1
- Thermal Resistance Data: θJA and ΨJT in Estimation of TJ: Part 2
- Surface Temperature Measurements: Methods for Fastening Thermocouples
- Surface Temperature Measurements: Thermocouple Mounting Position
- Surface Temperature Measurements: Treatment of Thermocouple Tips
- Surface Temperature Measurements: Influence of the Thermocouple
- Estimating TJ: Basic Calculation Equations
- Estimating TJ: Calculation Example Using θJA
- Estimating TJ: Calculation Example Using ΨJT
- Estimating TJ: Calculation Example Using Transient Thermal Resistance
- Estimation of Heat Dissipation Area in Surface Mounting and Points to be Noted
- Surface Temperature Measurements: Thermocouple Types
- Summary
- Collection of Important Points Relating to Thermal Design
Switching Noise
- Procedures in Noise Countermeasures
- What is EMC?
-
Dealing with Noise Using Capacitors
- Understanding the Frequency Characteristics of Capacitors, Relative to ESR and ESL
- Measures to Address Noise Using Capacitors
- Effective Use of Decoupling (Bypass) Capacitors Point 1
- Effective Use of Decoupling Capacitors Point 2
- Effective Use of Decoupling Capacitors, Other Matters to be Noted
- Effective Use of Decoupling Capacitors, Summary
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Dealing with Noise Using Inductors
- Frequency-Impedance Characteristics of Inductors and Determination of Inductor’s Resonance Frequency
- Basic Characteristics of Ferrite Beads and Inductors and Noise Countermeasures Using Them
- Dealing with Noise Using Common Mode Filters
- Points to be Noted: Crosstalk and Noise from GND Lines
- Summary of Dealing with Noise Using Inductors
- Other Noise Countermeasures
- Basics of EMC – Summary
Simulation
- Thermal Simulation of PTC Heaters
- Thermal Simulation of Linear Regulators
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Foundations of Electronic Circuit Simulation Introduction
- About SPICE
- SPICE Simulators and SPICE Models
- Types of SPICE simulation: DC Analysis, AC Analysis, Transient Analysis
- Types of SPICE simulation: Monte Carlo
- Convergence Properties and Stability of SPICE Simulations
- Types of SPICE Model
- SPICE Device Models: Diode Example–Part 1
- SPICE Device Models: Diode Example–Part 2
- SPICE Subcircuit Models: MOSFET Example―Part 1
- SPICE Subcircuit Models: MOSFET Example―Part 2
- SPICE Subcircuit Models: Models Using Mathematical Expressions
- About Thermal Models
- About Thermal Dynamic Model
- Summary
-
About the ROHM Solution Simulator
- How to Access the ROHM Solution Simulator
- Trying Out the ROHM Solution Simulator (1)
- Trying Out the ROHM Solution Simulator (2)
- Starting a Simulation Circuit in the ROHM Solution Simulator
- ROHM Solution Simulator Toolbar Functions and Basic Operations
- ROHM Solution Simulator: User Interface
- Execution of Simulations
- Method for Displaying Simulation Results
- Simulation Result Display Tool: Wavebox
- Simulation Results Display Tool: Waveform Viewer
- Customization of Simulations
- Exporting Circuit Data to PartQuest™ Explorer
- Purchasing Samples for Evaluation
- Optimization of PFC Circuits
- Optimization of Inverter Circuits
- About Thermal Simulations of DC-DC Converters
- Circuit-Theory-Based Design Simulation