Learn Know-how

Thermal Design of Semiconductor Components in Electronic EquipmentPositioning Vias Near Heat Sources

2023.07.19

Points of this article

・It is most effective to position vias as close to heat sources as possible.

・If vias are installed on the periphery rather than directly below, lateral (horizontal) paths are added to the heat dissipation route, and the thermal resistance rises.

The use of vias is a well-known method of lowering thermal resistance (promoting heat dissipation). The effect of a via varies depending on where it is installed. The greatest effect is obtained when a via is positioned as close as possible to a heat source.

The images below present the results of thermal simulations for cases in which vias are positioned immediately below a rear-surface exposed pad (left) and on the periphery of the pad (right). If the vias are positioned on the periphery rather than directly below, lateral (horizontal) paths are added to the heat dissipation route, and consequently the thermal resistance is increased.

【Download Documents】 Thermal Design of Semiconductor Components in Electronics

Thermal design has become a new issue in the design of electronic equipment in recent years, as thermal countermeasures have been the focus of attention. Although heat has been an important consideration for some time, the requirements for electronic equipment have changed in recent years, making it necessary to review conventional thermal countermeasures. This handbook describes thermal design based on the assumption that ICs and transistors are basically used in electronic equipment.

Download

Learn Know-how

Electrical Circuit Design

Thermal design

Switching Noise

Simulation